韩国政府拟投资约800万亿韩元建设西南部四座芯片厂，三星SK海力士各建两座 6月29日，韩国产业通商资源部长官金正官表示，预计将在韩国西南部建设四座芯片厂，投资约800万亿韩元（约合人民币4.2万亿元）。其中三星电子和SK海力士分别规划建设两座。同时，韩国政府表示，预计未来15年在芯片领域的投资将至少达到30万亿韩元，涵盖下一代内存、边缘人工智能和国防等领域。根据规划，中部地区将重点发展先进封装，东南部将打造半导体材料、零部件、设备及新一代功率半导体产业集群。忠清地区的芯片封装集群投资预计达到81万亿韩元。

South Korea Plans Approximately KRW 800tn Investment to Build Four Chip Fabs in Southwest Region, with Samsung and SK Hynix Each to Build Two On June 29, South Korea’s Minister of Trade, Industry and Energy Kim Jung-kwan said that four chip fabs are expected to be built in the country’s southwest region, with total investment of approximately KRW 800tn, equivalent to around RMB 4.2tn. Samsung Electronics and SK Hynix each plan to build two fabs. At the same time, the South Korean government said investment in the semiconductor sector over the next 15 years is expected to reach at least KRW 30tn, covering areas including next-generation memory, edge AI, and defense applications. Under the plan, the central region will focus on advanced packaging, while the southeast region will develop semiconductor materials, components, equipment, and next-generation power semiconductor clusters. Investment in the chip packaging cluster in the Chungcheong region is expected to reach KRW 81tn.

企业动态(6月23日) 拆分芯片团队独立造芯，快手垂直算力自研实现商业化突破 近日，快手拆分内部芯片事业部成立凌川科技完成数亿元A+轮融资，标志其自研造芯业务全面走向独立市场化运营。凌川科技2024年3月正式独立，由快手联合北京AI基金控股，专注视频与多模态大模型专用算力芯片研发。旗下成熟产品SL200累计出货近十万颗，覆盖快手99.7%直播转码业务，支撑平台7亿用户视频流转，同时对外供货阿里云、百度云、B站等企业。该芯片连续三年拿下国际视频编码赛事冠军，压缩效率优于英伟达同类方案，算力能耗降低三成。新一代全国产3D堆叠芯片已于4月完成流片，本轮融资将用于新品迭代、现有芯片扩产及海外市场拓展。依托互联网场景优势，凌川同步推出加速卡、算力一体机等硬件方案，落地智算、安防、车载多场景，成为国内垂直视频算力赛道核心国产供应商。 点评：快手独立造芯是互联网平台算力自主化的典型缩影，与阿里平头哥、百度昆仑芯路径趋同，印证大厂自研专用芯片已成行业必然选择。过去短视频、直播平台高度依赖海外通用GPU，采购与运维成本居高不下，同时存在算力供给约束风险，自研ASIC芯片可深度贴合视频转码、AI推理专属需求，实现降本与自主可控双重目标。不同于通用大算力芯片赛道的激烈内卷，凌川深耕视频垂直领域，以真实业务场景反向定义芯片架构，形成差异化竞争壁垒。从内部自用走向对外商用，也打开互联网芯片企业盈利空间，推动国产算力软硬件生态协同完善。快手独立造芯将带动上下游流片、封装、服务器产业链需求释放，加速国内多模态算力底层装备国产化进程。

Company Trend（June 23） Kuaishou Chip Unit Lingchuan Technology Achieves Commercial Breakthrough in In-House AI Compute Chips Kuaishou has spun off its internal chip division into an independent entity, Lingchuan Technology, which has completed a Series A+ funding round raising several hundred million RMB, marking a full transition of its self-developed chip business toward independent market-oriented operations. Lingchuan Technology was formally established as an independent company in March 2024, jointly controlled by Kuaishou and a Beijing AI fund, focusing on the development of dedicated compute chips for video processing and multimodal large models. Its flagship mature product SL200 has shipped nearly 100,000 units, covering 99.7% of Kuaishou’s live-streaming transcoding workloads and supporting video traffic for approximately 700 million platform users. The chip is also supplied to external customers including Alibaba Cloud, Baidu Cloud, and Bilibili. The SL200 has reportedly won international video encoding competitions for three consecutive years, delivering higher compression efficiency than comparable Nvidia solutions while reducing compute energy consumption by approximately 30%. A next-generation fully domestic 3D-stacked chip completed tape-out in April 2026. The new funding will be used for product iteration, capacity expansion of existing chips, and overseas market development. Leveraging its internet-scale application scenarios, Lingchuan Technology is also deploying hardware solutions including AI acceleration cards and integrated compute appliances, targeting use cases in intelligent computing, security, and automotive applications. The company is emerging as a key domestic supplier in China’s vertical video compute chip segment.

企业动态（6月16日） 台积电与安靠科技签下十年长约：亚利桑那州先进封装"双雄联手"破局AI产能瓶颈6月16日，全球晶圆代工龙头台积电与全球第二大OSAT（外包封测）企业安靠科技（Amkor）双双宣布，双方达成一项为期十年的战略合作协议。根据协议，双方将建立紧密合作框架，由台积电向安靠采购先进封装与测试服务，共同扩充亚利桑那州先进半导体封装产能。安靠此前已选择在亚利桑那州皮奥里亚建厂，核心考量正是靠近台积电亚利桑那州园区。

Company Trend（June.16） TSMC and Amkor Sign Ten-Year Agreement: Arizona Advanced Packaging Partnership Targets AI Capacity Bottlenecks On June 16, TSMC, the world’s leading foundry, and Amkor Technology, the world’s second-largest outsourced semiconductor assembly and test (OSAT) provider, announced that they had entered into a ten-year strategic partnership agreement.