01
Company Updates（August.25）
Apple Unveils First In-House 2nm Chip M6 Alongside M5 Ultra, Bringing Mac Lineup Fully into the 2nm Era
On August 25, Apple unveiled two new in-house chips, the M6 and M5 Ultra, along with new Mac mini and Mac Studio models powered by the chips, with pre-orders opening immediately. The M6 is Apple’s first 2nm chip, featuring a larger 12-core CPU, a 12-core GPU with integrated neural accelerators, a dual 16-core Neural Engine, and up to 170GB/s of unified memory bandwidth. The M6 incorporates an all-new 12-core CPU architecture, delivering up to 1.2× the multithreaded performance of the M5 and up to 2.4× that of the M1. The M6’s 12-core GPU has two more cores than the M5, with each core equipped with neural accelerators. In AI workloads, peak GPU compute performance is nearly 30% higher than the M5 and more than eight times that of the M1. The M5 Ultra, meanwhile, adopts a new generation of UltraFusion technology and, for the first time in an M-series SoC, uses a four-die architecture. It offers up to a 36-core CPU and an 80-core GPU, with unified memory bandwidth reaching 1.2TB/s. With the M6, the Mac mini can deliver up to four times the AI performance.
Comments:As Apple’s first in-house 2nm chip, the M6 marks another step ahead for the company in the adoption of advanced process technologies. In less than six years, Apple has moved from 5nm with the M1 to 2nm with the M6 across four generations of process advancement. The continued gains in single-threaded and multithreaded performance also demonstrate the maturity of TSMC’s 2nm process. The M5 Ultra’s four-die architecture, meanwhile, highlights Apple’s technology capabilities in chiplet-based design. By using advanced packaging to interconnect multiple dies, Apple can achieve substantial performance scaling without relying solely on increasing the size of a single die. For the PC processor market, the continued performance advances of Apple’s M-series chips are putting greater pressure on Intel and AMD to accelerate improvements in both power efficiency and AI compute performance. For China’s domestic chip industry, Apple’s mass-production deployment of 2nm process technology and advanced packaging provides a useful technological reference point for the development roadmap of high-end domestic chips.
02
Company Updates（August.26）
SK Hynix’s HBM4 Capacity Expansion Drives Order Growth for South Korean Equipment Suppliers, with Test Equipment Demand Expected to Outpace Production Growth
According to ETNews, South Korean equipment suppliers are gaining a growing share of SK Hynix’s HBM wafer-testing equipment supply chain, with domestic manufacturers including Digital Frontier and Unittest continuing to secure new orders. Industry sources said Digital Frontier and Unittest have received a combined KRW 283.94bn worth of HBM4 wafer-testing equipment orders from SK Hynix this year. Of this amount, cumulative HBM4 wafer tester orders for Digital Frontier and Unittest reached KRW 232.1bn and KRW 51.84bn, respectively. Both companies previously focused primarily on general-purpose memory testing equipment for products such as DRAM and NAND, but have recently been expanding their supply of dedicated HBM testing equipment. Digital Frontier has supplied wafer testers to SK Hynix since the HBM3 generation, while Unittest entered the supply chain with the HBM4 generation. Industry sources noted that as HBM technology continues to advance, the number of test items is increasing and testing times are becoming longer. As a result, demand for test equipment could grow faster than HBM production itself. Starting with HBM4, the trend among memory suppliers toward using dedicated HBM testing equipment is expected to become even more pronounced. SK Hynix entered HBM4 mass production in the second quarter and plans to further expand output in the second half of the year.
Comments:SK Hynix’s HBM4 capacity expansion is driving a surge in orders for South Korean testing equipment suppliers, illustrating how value creation across the HBM supply chain is spreading from memory manufacturing into upstream equipment. As HBM evolves from 8-high to 16-high stacking and I/O width expands from 1,024 bits to 2,048 bits, testing complexity is increasing exponentially. More test items and longer testing times mean that demand for testing equipment could grow faster than HBM production itself. Digital Frontier and Unittest’s shift from general-purpose memory testing equipment toward dedicated HBM systems demonstrates how successive generations of HBM technology are reshaping the semiconductor equipment supply chain. For China’s domestic semiconductor testing equipment industry, the incremental equipment market created by HBM represents a clear opportunity for domestic substitution. HBM testing equipment is currently dominated by South Korean, U.S., and Japanese suppliers. Breakthroughs by Chinese companies in probe cards, testers, handlers, and related equipment could directly benefit from rising equipment procurement demand driven by the global expansion of HBM capacity.
03
Company Updates（August.27）
Nvidia Q2 FY2027 Revenue Reaches USD 96.22bn, Up 106% YoY, as Company Issues First FY2028 Growth Guidance of Around 70%
In the early hours of August 27 Beijing time, Nvidia released its financial results for the second quarter of fiscal 2027. Quarterly revenue reached USD 96.22bn, up 106% YoY and 18% QoQ, exceeding market expectations. GAAP net income was USD 59.7bn. Data center revenue reached USD 89bn, up 117% YoY. The company also issued its first revenue growth guidance for fiscal 2028, projecting growth of approximately 70%, significantly above the market’s previous expectation of around 45%. Following the stronger-than-expected results, Nvidia shares surged nearly 5% in after-hours trading.
Comments:Nvidia’s quarterly revenue of USD 96.2bn and data center revenue of USD 89bn both reached record highs, with YoY growth exceeding 100% in both metrics. Sustaining growth of this magnitude is extremely rare in the history of the semiconductor industry. Even more noteworthy is Nvidia’s first guidance for approximately 70% revenue growth in fiscal 2028, well above the market’s previous expectation of 45%. With annual revenue already approaching USD 400bn, guidance implying nearly USD 100bn of additional revenue highlights Nvidia’s highly bullish view on the durability of AI compute demand. Rather than signaling a cyclical peak, it reinforces the view that AI compute demand remains far from reaching its ceiling.
From an industry transmission perspective, Nvidia’s stronger-than-expected results and robust guidance should directly lift expectations across the broader AI hardware supply chain, including TSMC’s CoWoS capacity, HBM, optical modules, PCBs, and server ODM manufacturing. For China’s domestic AI compute industry, Nvidia’s sustained high growth not only validates the enormous market opportunity in AI computing, but also indicates that the barriers around the CUDA ecosystem are continuing to strengthen. Beyond catching up in chip technology, domestic AI compute vendors also need to build differentiated competitiveness in software ecosystems and system-level solutions.
04
Market Updates（August.28）
TrendForce: Combined Revenue of Top Five Global NAND Flash Brands Surges 77% QoQ to USD 68.87bn in Q2 2026
According to the latest NAND Flash industry research from TrendForce, AI server procurement remained robust in the second quarter of 2026, while strong demand for enterprise SSDs led to an overall supply shortage in the NAND Flash market. This enabled manufacturers to leverage stronger pricing power to raise average selling prices (ASPs) substantially. Against this backdrop, the combined revenue of the world’s top five NAND Flash brands increased 77% QoQ to USD 68.87bn. In terms of rankings, Samsung remained the market leader with revenue of USD 23.06bn and a 29.3% market share. SK Hynix, including Solidigm, ranked second with revenue of USD 14.27bn. Micron’s revenue reached USD 11.85bn, up 99.2% QoQ—the highest growth rate among the top five—lifting the company to third place. Kioxia generated revenue of USD 10.72bn, while SanDisk posted USD 8.97bn. Looking ahead to the third quarter, continued strong eSSD demand from AI servers, combined with limited additions to NAND Flash capacity, is expected to keep ASPs firm and support further growth in total industry revenue.
Comments:The top five NAND Flash brands generated combined quarterly revenue of USD 68.87bn, up 77% QoQ, confirming that AI-driven memory demand is expanding beyond DRAM/HBM into NAND Flash. Strong enterprise SSD demand is the key driver. As AI workloads shift from training toward inference, rising demand for high-speed, high-capacity storage is reshaping the NAND Flash demand mix. Micron’s 99.2% QoQ revenue growth and rise to third place demonstrate that suppliers with product portfolios shifting toward higher-value enterprise SSDs are benefiting more significantly from the current upcycle.
From a supply-demand perspective, major memory manufacturers are prioritizing capital expenditure toward DRAM/HBM, leaving limited new NAND Flash capacity. Supply-side constraints combined with expanding demand are therefore creating a persistent supply-demand gap. For China’s domestic NAND industry, YMTC has entered the global top three in shipment volume for the first time with a 14% share, but its shipment scale has yet to translate fully into revenue. Its product mix remains concentrated in consumer applications, with a relatively low share of higher-priced enterprise SSDs. Amid a global NAND upcycle characterized by simultaneous increases in both prices and shipment volumes, the next key challenge for YMTC and China’s domestic memory industry is how to move from “No. 3 in shipments” to “No. 3 in revenue.”
05
Company Updates（August.23）
Longsys H1 2026 Net Profit Attributable to Shareholders Surges 71,528.66% YoY, as AI Compute Demand Drives Explosive Growth in Enterprise SSD Business
On August 23, Longsys released its 2026 interim report. In the first half of the year, the company generated revenue of RMB 24.088bn, up 136.26% YoY. Net profit attributable to shareholders of the listed company reached RMB 10.577bn, surging 71,528.66% YoY, while net profit attributable to shareholders excluding non-recurring gains and losses reached RMB 10.047bn, up 31,096.33% YoY. The company said demand from AI-related servers, data centers, and other applications drove explosive growth in enterprise SSD demand. Longsys continued to increase R&D investment, with its enterprise storage business delivering stronger-than-expected growth while development of its in-house controller chip business continued to advance steadily.
06
Company Updates（August.23）
Unicomp Technology Delivers Its 10,000th Intelligent Inspection System, Chairman Liu Jun Named “2026 China Manufacturing Industry Leader”
Unicomp Technology announced the delivery of its 10,000th intelligent inspection system, marking a new stage in which domestically developed intelligent inspection equipment is moving from technological breakthroughs toward large-scale deployment. From its first system to its 10,000th, Unicomp Technology has achieved major advances in inspection capabilities, progressing from micron-level to nanometer-level precision and from 2D to 3D inspection. Its products are widely used in high-end manufacturing sectors including semiconductors, new energy, and commercial aerospace. The company has served more than 4,000 customers worldwide, covering over 70 countries and regions. In addition, Chairman Liu Jun was named a “2026 China Manufacturing Industry Leader” in recognition of his outstanding contributions to the high-end equipment manufacturing sector.
07
Company Updates（August.26）
Leon Microelectronics Plans RMB 3bn Investment in 12-Inch Semiconductor Silicon Wafer Project, with Annual Output Value Expected to Exceed RMB 1.3bn at Full Capacity
On August 26, Leon Microelectronics announced that it has signed a framework agreement with the People’s Government of Nanhu District, Jiaxing, to invest in a project with monthly capacity of 200,000 12-inch lightly doped substrate wafers and 120,000 12-inch silicon epitaxial wafers. The project has a planned total investment of approximately RMB 3bn, including around RMB 2.9bn in fixed-asset investment. According to the announcement, once fully ramped, the project is expected to generate annual output value of more than RMB 1.3bn. The construction period is five years, and the project will be implemented by the company’s controlled subsidiary, Jinruihong Angxin Microelectronics (Jiaxing) Co., Ltd. Leon Microelectronics said Jinruihong Angxin Microelectronics is currently implementing a project with annual capacity of 960,000 12-inch silicon epitaxial wafers. If the newly proposed project proceeds, the company will ultimately establish comprehensive production capacity of 200,000 lightly doped substrate wafers per month plus 200,000 silicon epitaxial wafers per month. In the first half of this year, Leon Microelectronics recorded revenue of RMB 2.094bn, up 25.72% YoY, while net profit attributable to shareholders of the listed company reached RMB 83.9726mn, turning profitable from a loss in the same period last year. Revenue from 12-inch silicon wafers reached RMB 613mn, up 74.02% YoY.
400-110-5656
返回新闻列表
关注企业公众号